Streamline your patent due diligence with deep analytics for patents, inventors, and attorneys



Compare patents by technology sector



Deep Analytics



Quickly evaluate patents of interest

► Want to see more? Join for free!

PatentQuant Patent Profile
Generated January 22, 2018

Method for connection of circuit units

Patent Number: 6,845,554

Patent Information

Abstract
The invention creates a method for connection of circuit units (101a-10n) which are arranged on a wafer (100), in which the wafer (100) is fitted to a first film (102a), the wafer (100) is sawn such that the circuit units (101a-101n) which are arranged on the wafer (100) are separated, the functional circuit units (101d) are picked up by means of a handling device (101) and are placed down on a second film (102b) by means of the handling device (103), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units (101d).
Patent Number: 6,845,554
Issue Date: 2005-01-25

Primary Category

Executive Summary

Summary

This patent was granted in ► Log In, which is ► Log In speed.

It has ► Log In claims, which is ► Log In than average for this category.

Its proximity to basic research is ► Log In than others in this category, and it displays ► Log In technology cycle time.

This patent received ► Log In citations from other patents, and references ► Log In other patents, as compared to other patents in this category.

Grant Time

► Log In

Claims

► Log In

► Want to see more? Join for free!

PatentStat Scores in Not categorized
These scores show the percentile ranks for each metric.
For example, a score of 90 means that 90% of similar patents had lower scores.

Patent Grant Time

This patent had ► Log In grant time compared to others in this category.

Patent grant time can be influenced by many factors. Activities within the USPTO that are beyond the control of patent attornies can influence grant time, but short grant times can also indicate well-written patents and dedicated efforts to respond rapidly to USPTO office actions with strong arguments. Shorter grant times are preferable, and the scores for this section are inverse measures — higher scores are better.

Patent Claims

This patent has ► Log In claims compared to others in this category.

The number of claims in a patent is correlated with its strength. Because greater claim counts increase the cost of a patent, more claims can indicate the importance an applicant assigns to a patent. Importantly, some may elect to file claims across multiple patents. A higher score in this metric indicates more claims, relative to others in this category.

Citations From Other Patents

This patent has received ► Log In citations from other patents, than others in this category.

Citations from other patents are an important measure of the significance of a patent. More citations indicate that other technologies build on a patent. Higher scores in this metric are better, and indicate more citations from other patents.

Citations to Other Patents

This patent referenced ► Log In citations to other patents, than others in this category.

A lower number of citations to other patents can be a sign of diminished patent strength. More citations indicate dependence on more other technologies. Higher scores in this category are better, and indicate fewer citations to other patents.

Research and Innovation Indicators
These are percentile ranks — they indicate the percentage of peers with lower scores.

Proximity to Basic Research

► Log In

0%

Proximity to Basic Research

This patent has ► Log In proximity to basic research compared to others in this category.

Proximity to basic research is measured by comparing the number of citations to non-patent literature among a cohort of patents. Because most non-patent citations are primary research papers, a higher count indicates greater proximity to basic research.

► Want to see more? Join for free!

Citations

Patents cited by this patent

Patent Title
6,219,908 Method and apparatus for manufacturing known good semiconductor die
5,796,264 Apparatus for manufacturing known good semiconductor dice

Patents that cite this patent

Patent Title
9,324,614 Through via nub reveal method and structure
9,196,597 Semiconductor package with single sided substrate design and manufacturing methods thereof
9,159,672 Through via connected backside embedded circuit features structure and method
9,129,943 Embedded component package and fabrication method
9,082,833 Through via recessed reveal structure and method
9,059,058 Image sensor device with IR filter and related methods
9,054,117 Wafer level package and fabrication method
9,048,298 Backside warpage control structure and fabrication method
9,013,017 Method for making image sensors using wafer-level processing and associated devices
8,981,572 Conductive pad on protruding through electrode semiconductor device
8,952,522 Wafer level package and fabrication method
8,946,883 Wafer level fan-out package with a fiducial die
8,941,222 Wafer level semiconductor package and manufacturing methods thereof
8,937,381 Thin stackable package and method
8,900,995 Semiconductor device and manufacturing method thereof
8,884,424 Semiconductor package with single sided substrate design and manufacturing methods thereof
8,796,561 Fan out build up substrate stackable package and method
8,791,501 Integrated passive device structure and method
8,710,649 Wafer level package and fabrication method
8,691,632 Wafer level package and fabrication method
8,624,374 Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
8,569,894 Semiconductor package with single sided substrate design and manufacturing methods thereof
8,552,548 Conductive pad on protruding through electrode semiconductor device
8,501,543 Direct-write wafer level chip scale package
8,487,445 Semiconductor device having through electrodes protruding from dielectric layer
8,486,764 Wafer level package and fabrication method
8,440,554 Through via connected backside embedded circuit features structure and method
8,421,226 Device including an encapsulated semiconductor chip and manufacturing method thereof
8,405,213 Semiconductor package including a stacking element
8,390,130 Through via recessed reveal structure and method
8,378,466 Wafer-level semiconductor device packages with electromagnetic interference shielding
8,372,689 Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
8,358,001 Semiconductor device packages, redistribution structures, and manufacturing methods thereof
8,324,511 Through via nub reveal method and structure
8,320,134 Embedded component substrate and manufacturing methods thereof
8,298,866 Wafer level package and fabrication method
8,294,276 Semiconductor device and fabricating method thereof
8,278,746 Semiconductor device packages including connecting elements
8,258,633 Semiconductor package and multichip arrangement having a polymer layer and an encapsulant
8,193,647 Semiconductor device package with an alignment mark
8,188,584 Direct-write wafer level chip scale package
8,119,455 Wafer level package fabrication method
8,110,916 Chip package structure and manufacturing methods thereof
8,035,213 Chip package structure and method of manufacturing the same
7,977,163 Embedded electronic component package fabrication method
7,932,595 Electronic component package comprising fan-out traces
7,902,660 Substrate for semiconductor device and manufacturing method thereof
7,723,210 Direct-write wafer level chip scale package
7,714,431 Electronic component package comprising fan-out and fan-in traces
7,692,286 Two-sided fan-out wafer escape package
7,576,436 Structure of wafer level package with area bump
7,572,681 Embedded electronic component package
7,420,272 Two-sided wafer escape package
7,361,533 Stacked embedded leadframe
7,247,523 Two-sided wafer escape package

► Want to see more? Join for free!

Information presented on this site is collected from the USPTO and other sources. Errors may have been introduced in the original assembly or analysis of the data.
No warranties are expressed or implied.The content of this site is not a substitute for skilled legal, financial, or other guidance.
Copyright thinkBiotech LLC. All rights reserved.
Privacy policy.
`abc