This patent had ► Log In grant time compared to others in this category.
Patent grant time can be influenced by many factors. Activities within the USPTO that are beyond the control of patent attornies can influence grant time, but short grant times can also indicate well-written patents and dedicated efforts to respond rapidly to USPTO office actions with strong arguments. Shorter grant times are preferable, and the scores for this section are inverse measures — higher scores are better.
This patent has ► Log In claims compared to others in this category.
The number of claims in a patent is correlated with its strength. Because greater claim counts increase the cost of a patent, more claims can indicate the importance an applicant assigns to a patent. Importantly, some may elect to file claims across multiple patents. A higher score in this metric indicates more claims, relative to others in this category.
This patent has received ► Log In citations from other patents, than others in this category.
Citations from other patents are an important measure of the significance of a patent. More citations indicate that other technologies build on a patent. Higher scores in this metric are better, and indicate more citations from other patents.
This patent referenced ► Log In citations to other patents, than others in this category.
A lower number of citations to other patents can be a sign of diminished patent strength. More citations indicate dependence on more other technologies. Higher scores in this category are better, and indicate fewer citations to other patents.
This patent has ► Log In proximity to basic research compared to others in this category.
Proximity to basic research is measured by comparing the number of citations to non-patent literature among a cohort of patents. Because most non-patent citations are primary research papers, a higher count indicates greater proximity to basic research.
|8,817,248||Simultaneous multi-spot inspection and imaging|
|7,969,465||Method and apparatus for substrate imaging|
|7,968,354||Methods for correlating backside and frontside defects detected on a specimen and classification of backside defects|
|7,869,023||System for detecting anomalies and/or features of a surface|
|7,679,735||Optical system for detecting anomalies and/or features of surfaces|
|7,492,451||Simultaneous multi-spot inspection and imaging|
|7,365,834||Optical system for detecting anomalies and/or features of surfaces|
|7,280,199||System for detecting anomalies and/or features of a surface|
|7,088,443||System for detecting anomalies and/or features of a surface|
|7,012,684||Method and apparatus to provide for automated process verification and hierarchical substrate examination|
|6,954,267||Device for measuring surface defects|
|6,813,032||Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques|
|6,791,680||System and method for inspecting semiconductor wafers|
|6,721,045||Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques|
|6,707,545||Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems|
|6,707,544||Particle detection and embedded vision system to enhance substrate yield and throughput|
|6,697,517||Particle detection and embedded vision system to enhance substrate yield and throughput|
|6,693,708||Method and apparatus for substrate surface inspection using spectral profiling techniques|
|6,630,995||Method and apparatus for embedded substrate and system status monitoring|
|6,608,676||System for detecting anomalies and/or features of a surface|
|6,603,542||High sensitivity optical inspection system and method for detecting flaws on a diffractive surface|
|6,407,809||Optical inspection system and method|
|6,121,156||Contact monitor, method of forming same and method of analyzing contact-, via-and/or trench-forming processes in an integrated circuit|
|6,020,957||System and method for inspecting semiconductor wafers|
|5,818,576||Extraneous substance inspection apparatus for patterned wafer|